Thermal Fatigue and Failure Analysis of SnAgCu Solder...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 10

Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions

Collins, M.N., Punch, J., Coyle, R., Reid, M., Popowich, R., Read, P., Fleming, D.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2150223
File:
PDF, 881 KB
english, 2011
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