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Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias
Tegueu, A.K., Yang Liu, Jacob, S., Glover, M.D., Schaper, L.W., Burkett, S.L.Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2159973
File:
PDF, 617 KB
english, 2011