High-Frequency Modeling of TSVs for 3-D Chip Integration...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 10

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Ndip, I., Curran, B., Lobbicke, K., Guttowski, S., Reichl, H., Lang, K.-D., Henke, H.
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2164915
File:
PDF, 1.22 MB
english, 2011
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