Pre-Bond and Post-Bond Test and Signal Recovery Structure to Characterize and Repair TSV Defect Induced Signal Degradation in 3-D System
Minki Cho, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Mukhopadhyay, S.Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2166961
File:
PDF, 991 KB
english, 2011