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Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives
Heuck, N., Langer, A., Stranz, A., Palm, G., Sittig, R., Bakin, A., Waag, A.Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2167154
File:
PDF, 684 KB
english, 2011