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Advanced Multilayer Thick-Film System-on-Package Technology for Miniaturized and High Performance CPW Microwave Passive Components
Samanta, K.K., Robertson, I.D.Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2167231
File:
PDF, 1.37 MB
english, 2011