Reliability of Lead-Free Solder Joints Under a Wide Range...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 Vol. 1; Iss. 12

Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions

Hongtao Ma, Ahmad, M., Kuo-Chuan Liu
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Volume:
1
Year:
2011
Language:
english
DOI:
10.1109/tcpmt.2011.2171054
File:
PDF, 1.37 MB
english, 2011
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