Structure Design Optimization and Reliability Analysis on a...

IEEE Transactions on Device and Materials Reliability 2012 Vol. 12; Iss. 2

Structure Design Optimization and Reliability Analysis on a Pyramidal-Shape Three-Die-Stacked Package With Through-Silicon Via

Che, F.X., Lim, S.P.S., Chai, T.C., Xiaowu Zhang
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Volume:
12
Year:
2012
Language:
english
DOI:
10.1109/tdmr.2011.2176126
File:
PDF, 1.32 MB
english, 2012
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