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Three-Dimensional Wafer Stacking Using Cu–Cu Bonding for Simultaneous Formation of Electrical, Mechanical, and Hermetic Bonds
Chuan Seng Tan, Lan Peng, Ji Fan, Hongyu Li, Shan GaoVolume:
12
Year:
2012
Language:
english
DOI:
10.1109/tdmr.2012.2188802
File:
PDF, 845 KB
english, 2012