Flip Chip Assembly of Thinned Silicon Die on Flex...

IEEE Transactions on Electronics Packaging Manufacturing 2008 Vol. 31; Iss. 1

Flip Chip Assembly of Thinned Silicon Die on Flex Substrates

Banda, C., Johnson, R.W., Tan Zhang, Zhenwei Hou, Charles, H.K.
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Volume:
31
Year:
2008
Language:
english
DOI:
10.1109/tepm.2007.914217
File:
PDF, 1.88 MB
english, 2008
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