An X-Ray Imaging-Based Layer Alignment and Tape Deformation...

IEEE Transactions on Electronics Packaging Manufacturing 2008 Vol. 31; Iss. 2

An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards

Tick, T., Jantunen, H.
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Volume:
31
Year:
2008
Language:
english
DOI:
10.1109/tepm.2008.919330
File:
PDF, 1.00 MB
english, 2008
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