Design and Evaluation of Bioepoxy-Flax Composites for...

IEEE Transactions on Electronics Packaging Manufacturing 2008 Vol. 31; Iss. 3

Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit Boards

Lincoln, J.D., Shapiro, A.A., Earthman, J.C., Saphores, J.-D.M., Ogunseitan, O.A.
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Volume:
31
Year:
2008
Language:
english
DOI:
10.1109/tepm.2008.926273
File:
PDF, 1.06 MB
english, 2008
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