Detection of Thermal Cycling-Induced Failures in...

IEEE Transactions on Electronics Packaging Manufacturing 2008 Vol. 31; Iss. 3

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

Putaala, J., Kangasvieri, T., Nousiainen, O., Jantunen, H., Moilanen, M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
31
Year:
2008
Language:
english
DOI:
10.1109/tepm.2008.926289
File:
PDF, 3.09 MB
english, 2008
Conversion to is in progress
Conversion to is failed