Design Envelopes and Optical Feature Extraction Techniques...

IEEE Transactions on Electronics Packaging Manufacturing 2009 Vol. 32; Iss. 4

Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D.
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Volume:
32
Year:
2009
Language:
english
DOI:
10.1109/tepm.2009.2031873
File:
PDF, 3.08 MB
english, 2009
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