Packaging and integration technologies for future...

Packaging and integration technologies for future high-frequency power supplies

Mathuna, S.C.O., Byrne, P., Duffy, G., Chen, W., Ludwig, M., O'Donnell, T., McCloskey, P., Duffy, M.

How much do you like this book?

What’s the quality of the file?

Download the book for quality assessment

What’s the quality of the downloaded files?

Volume:

Year:

2004

Language:

english

DOI:

10.1109/tie.2004.837904

File:

PDF, 1.84 MB

english, 2004

Conversion to is in progress

Conversion to is failed