Backside Infrared Interferometric Patterned Wafer Thickness...

IEEE Transactions on Semiconductor Manufacturing 2010 Vol. 23; Iss. 3

Backside Infrared Interferometric Patterned Wafer Thickness Sensing for Through-Silicon-Via (TSV) Etch Metrology

Weng Hong Teh, Marx, D., Grant, D., Dudley, R.
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Volume:
23
Year:
2010
Language:
english
DOI:
10.1109/tsm.2010.2046657
File:
PDF, 4.39 MB
english, 2010
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