Copper-selective electrochemical filling of macropore...

Nanoscale Research Letters 2012 / 12 Vol. 7; Iss. 1

Copper-selective electrochemical filling of macropore arrays for through-silicon via applications

Thomas Defforge, Jérôme Billoué, Marianne Diatta, François Tran-Van, Gaël Gautier
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Volume:
7
Language:
english
DOI:
10.1186/1556-276x-7-375
Date:
December, 2012
File:
PDF, 424 KB
english, 2012
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