Thermal–Mechanical Coupling Analysis for Coupled Power- and...

IEEE Transactions on Device and Materials Reliability 2008 Vol. 8; Iss. 1

Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages

Yi-Shao Lai,, Tong Hong Wang,, Chang-Chi Lee,
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Volume:
8
Year:
2008
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2007.915045
File:
PDF, 1.13 MB
english, 2008
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