Effect of a Cu seed layer on electroplated Cu film

Microelectronic Engineering 2013 / 5 Vol. 105

Effect of a Cu seed layer on electroplated Cu film

Pan, Yan, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun
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Volume:
105
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.12.004
Date:
May, 2013
File:
PDF, 1.21 MB
english, 2013
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