Ultrathin CVD Cu Seed Layer Formation Using Copper...

Ultrathin CVD Cu Seed Layer Formation Using Copper Oxynitride Deposition and Room Temperature Remote Hydrogen Plasma Reduction

Kim, Hoon, Bhandari, Harish B., Xu, Sheng, Gordon, Roy G.
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Volume:
155
Year:
2008
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2912326
File:
PDF, 2.03 MB
english, 2008
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