Through-silicon vias enable next-generation SiGe power...

IBM Journal of Research and Development 2008 Vol. 52; Iss. 6

Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications

Joseph, A. J., Gillis, J. D., Doherty, M., Lindgren, P. J., Previti-Kelly, R. A., Malladi, R. M., Wang, P.-C., Erturk, M., Ding, H., Gebreselasie, E. G., McPartlin, M. J., Dunn, J.
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Volume:
52
Year:
2008
Language:
english
DOI:
10.1147/jrd.2008.5388563
File:
PDF, 1.23 MB
english, 2008
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