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Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires
Yang, B., Motz, C., Rester, M., Dehm, G.Volume:
92
Language:
english
Journal:
Philosophical Magazine
DOI:
10.1080/14786435.2012.693215
Date:
September, 2012
File:
PDF, 627 KB
english, 2012