Thermal component model for electrothermal analysis of IGBT...

IEEE Transactions on Advanced Packaging 2001 / Aug. Vol. 24; Iss. 3

Thermal component model for electrothermal analysis of IGBT module systems

Chan-Su Yun,, Malberti, P., Ciappa, M., Fichtner, W.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.938309
Date:
January, 2001
File:
PDF, 237 KB
english, 2001
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