Accuracy of Physics-Based Via Models for Simulation of...

IEEE Transactions on Electromagnetic Compatibility 2012 / 10 Vol. 54; Iss. 5

Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays

Müller, Sebastian, Duan, Xiaomin, Kotzev, Miroslav, Zhang, Yao-Jiang, Fan, Jun, Gu, Xiaoxiong, Kwark, Young H., Rimolo-Donadio, Renato, Brüns, Heinz-Dietrich, Schuster, Christian
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Volume:
54
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/TEMC.2012.2192123
Date:
October, 2012
File:
PDF, 1.52 MB
english, 2012
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