[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Processing material evaluation and ultra-wideband modeling of through-strata-via (TSV) in 3D integrated circuits and systems
Xu, Zheng, Beece, Adam, Zhang, Dingyou, Chen, Qianwen, Rose, Kenneth, Lu, James Jian-QiangYear:
2010
Language:
english
DOI:
10.1109/ICSICT.2010.5667669
File:
PDF, 548 KB
english, 2010