Early Detection of Interconnect Degradation by Continuous...

IEEE Transactions on Device and Materials Reliability 2009 / 06 Vol. 9; Iss. 2

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance

Kwon, D., Azarian, M.H., Pecht, M.
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Volume:
9
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2009.2020170
Date:
June, 2009
File:
PDF, 1.03 MB
english, 2009
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