Fabrication of robust electrothermal MEMS devices using aluminum–tungsten bimorphs and polyimide thermal isolation
Pal, Sagnik, Xie, HuikaiVolume:
22
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/22/11/115036
Date:
November, 2012
File:
PDF, 2.19 MB
english, 2012