Modeling and experimental studies on thermosonic flip-chip...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Nov. Vol. 18; Iss. 4

Modeling and experimental studies on thermosonic flip-chip bonding

Sa-Yoon Kang,, Williams, P.M., Yung-Cheng Lee,
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.475282
Date:
January, 1995
File:
PDF, 605 KB
english, 1995
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