Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
Yoon, Sang Won, Glover, Michael D, Mantooth, H Alan, Shiozaki, KojiVolume:
23
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/23/1/015017
Date:
January, 2013
File:
PDF, 2.12 MB
english, 2013