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[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Method for direct interconnection of PCB power layer to chassis to minimize radiated emissions
Moongilan, DheenaYear:
2011
Language:
english
DOI:
10.1109/ISEMC.2011.6038305
File:
PDF, 1.60 MB
english, 2011