![](/img/cover-not-exists.png)
Integrated Packaging of a 1 kW Switching Module Using a Novel Planar Integration Technology
Liang, Z., vanWyk, J.D., Lee, F.C., Boroyevich, D., Scott, E.P., Chen, Z., Pang, Y.Volume:
19
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2003.820597
Date:
January, 2004
File:
PDF, 618 KB
english, 2004