40-$\mu{\rm m}$ Cu/Au Flip-Chip Joints Made by...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 01 Vol. 3; Iss. 1

40-$\mu{\rm m}$ Cu/Au Flip-Chip Joints Made by 200$^{\circ}{\rm C}$ Solid-State Bonding Process

Lin, Wen P., Sha, Chu-Hsuan, Lee, Chin C.
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2199991
Date:
January, 2013
File:
PDF, 5.08 MB
english, 2013
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