Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules
Yang, Li, Agyakwa, Pearl A., Johnson, C. MarkVolume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2012.2235836
Date:
March, 2013
File:
PDF, 941 KB
english, 2013