Physics-of-Failure Lifetime Prediction Models for Wire Bond...

Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

Yang, Li, Agyakwa, Pearl A., Johnson, C. Mark
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2012.2235836
Date:
March, 2013
File:
PDF, 941 KB
english, 2013
Conversion to is in progress
Conversion to is failed