Electromigration in Dual-Damascene CuMn Alloy IC...

IEEE Transactions on Device and Materials Reliability 2013 / 03 Vol. 13; Iss. 1

Electromigration in Dual-Damascene CuMn Alloy IC Interconnects

Lin, M. H., Oates, A. S.
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Volume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2013.2245507
Date:
March, 2013
File:
PDF, 279 KB
english, 2013
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