[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume

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