[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Millimeter-wave performance of various interconnections used for Si-based IC packaging technologies
Cui, Jie, Wang, Qidong, Daniel, Guidotti., Cao, Liqiang, Wan, LixiYear:
2012
Language:
english
Pages:
4
DOI:
10.1109/ICEPT-HDP.2012.6474740
File:
PDF, 1.62 MB
english, 2012