[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces - Braselton, GA, USA (14-17 March 1999)] Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - Do chip size limits exist for DCA?
Schubert, A., Dudek, R., Leutenbauer, R., Doring, R., Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., Tummala, R.Year:
1999
Language:
english
Pages:
8
DOI:
10.1109/ISAPM.1999.757303
File:
PDF, 1.14 MB
english, 1999
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