Chemical mechanical planarization of barrier layers by...

Microelectronic Engineering 2013 / 08 Vol. 108

Chemical mechanical planarization of barrier layers by using a weakly alkaline slurry

Wang, Chenwei, Gao, Jiaojiao, Tian, Jianying, Niu, Xinhuan, Liu, Yuling
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
108
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.04.001
Date:
August, 2013
File:
PDF, 1.52 MB
english, 2013
Conversion to is in progress
Conversion to is failed