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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - A comparative study of microstructure during solidification within ultrafine interconnects of different sizes and geometries
Wu, Zhiyong, Huang, Zhiheng, Wu, Dong, Zhang, YongYear:
2012
Language:
english
DOI:
10.1109/ICEPT-HDP.2012.6474626
File:
PDF, 2.51 MB
english, 2012