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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Copper filling process for small diameter, high aspect ratio Through Silicon Via (TSV)
Wei, Tiwei, Cai, Jian, Wang, Qian, Liu, Ziyu, Li, Yinan, Wang, Tao, Wang, DejunYear:
2012
Language:
english
DOI:
10.1109/ICEPT-HDP.2012.6474664
File:
PDF, 1.26 MB
english, 2012