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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Copper chemical mechanical polishing and wafer thinning with temporary bonding for Through Silicon Via interconnect
Liu, Ziyu, Cai, Jian, Wang, Qian, Wang, Tao, Wei, Tiwei, Li, LiYear:
2012
Language:
english
DOI:
10.1109/ICEPT-HDP.2012.6474665
File:
PDF, 1.34 MB
english, 2012