Effects of abrasive size distribution in chemical mechanical planarization: Modeling and verification
Jianfeng Luo,, Dornfeld, D.A.Volume:
16
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2003.815199
Date:
August, 2003
File:
PDF, 656 KB
english, 2003