[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Analysis on thermal resistance of LED module with various thermal vias
Hyeong Won Shin,, Hyo Soo Lee,, Seung Boo Jung,Year:
2011
Language:
english
DOI:
10.1109/IPFA.2011.5992760
File:
PDF, 1.10 MB
english, 2011