Height Measurement of Micro-Solder Balls on Metal Pad by...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 / 09 Vol. 2; Iss. 9

Height Measurement of Micro-Solder Balls on Metal Pad by White Light Projection

Wang, Fuliang, Qin, Jingwen, Han, Lei, Wang, Hengsheng
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Volume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2193617
Date:
September, 2012
File:
PDF, 1.31 MB
english, 2012
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