[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Nanotwin-modified copper interconnects and its effect on the physical properties of copper
Xu, Di, Xu, Luhua, Sriram, Vinay, Sun, Ke, Yang, Jenn-Ming, Tu, King-NingYear:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074307
File:
PDF, 2.50 MB
english, 2009