[IEEE 2009 IEEE 59th Electronic Components and Technology...

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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Nanotwin-modified copper interconnects and its effect on the physical properties of copper

Xu, Di, Xu, Luhua, Sriram, Vinay, Sun, Ke, Yang, Jenn-Ming, Tu, King-Ning
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Year:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074307
File:
PDF, 2.50 MB
english, 2009
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