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[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Technical review of characterization methods for thermal interface Materials (TIM)
Goel, Nitin, Anoop, T.K., Bhattacharya, A., Cervantes, Joseph A., Mongia, Rajiv K., Machiroutu, Sridhar V., Lin, Hau-Lan, Huang, Ya-Chi, Fan, Kuang-Cheng, Denq, Bar-Long, Liu, Chen-Hua, Lin, Chun-HungYear:
2008
Language:
english
DOI:
10.1109/ITHERM.2008.4544277
File:
PDF, 235 KB
english, 2008