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[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Direct wafer bonding for photonic MEMS and packaging applications
Arokiaraj, J., Cao Yu,, Vicknesh, S., Mithilesh, S., Ramam, A.Year:
2004
Language:
english
DOI:
10.1109/EPTC.2004.1396602
File:
PDF, 280 KB
english, 2004