![](/img/cover-not-exists.png)
Case study of a printed-wire-board concerning (Re-)Design for environment
Brandstotter, M., Knoth, R., Kopacek, B., Kopacek, P.Volume:
27
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/TEPM.2004.830506
Date:
January, 2004
File:
PDF, 505 KB
english, 2004