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Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement
R. Pitchumani, S. Ranganathan, R.C. Don, J.W. Gillespie Jr., M.A. LamontiaVolume:
39
Year:
1996
Language:
english
Pages:
15
DOI:
10.1016/0017-9310(95)00271-5
File:
PDF, 1.32 MB
english, 1996