Rheology and Thermal Conductivity of Diamond Powder-Filled...

IEEE Transactions on Components and Packaging Technologies 2009 / 12 Vol. 32; Iss. 4

Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging

Yongxi Zhang,, Xiangyang Hu,, Zhao, J.H., Kuang Sheng,, Cannon, W.R., Xiaohui Wang,, Fursin, L.
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/TCAPT.2009.2029701
Date:
December, 2009
File:
PDF, 504 KB
english, 2009
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